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COMPUPLAST® SOFTWARE / Articles posted by Compuplast (Page 2)

What is the appropriate boundary condition for temperature?

Flow inside a die can be simulated by most of Compuplast VEL™ modules. An axi-symmetric or planar flow inside a die can be simulated by using the 2DFem module, any profile die can be simulated by the 3DFem module, some profile dies and designed profile dies can be simulated by using the Profile die module, flat dies, spiral dies, flat spiral dies (stackable dies) or cross-head dies can be simulated by using the appropriate module. In all these modules the...

COMPUPLAST® Extrusion Seminar with Trial License

2-Day Seminar Sep 20 - 21, 2022; 9 am - 4:30 pm Location: Comfort Hotel Prague City East, Becvarova 14, 100 00, Prague, Czech Republic Tuition: 2-day Seminar for EUR 2,100 or  2-day Seminar for EUR 2,550 including 3-month license of VEL™ Material Properties module (with Extrusion Calculator™) OVERVIEW This seminar will teach a systematic and practical approach to designing, optimizing and troubleshooting single-screw extruders and dies in extrusion process. Attendees will gain a good understanding of practical rheology and how to use it for efficient die design. Explaining...

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